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Your Wafer Bumping and Testing Partner in Taiwan


Our strategic relationship with top semiconductor fabs and leading design houses in Taiwan provides a one-stop solution and uninterrupted delivery of services.

Shaping Solutions in Advanced Semiconductor Assembly and Test

Now offering full turnkey wafer Bump and wafer level packaging for advanced 28nm technology node.

Turnkey Test Services

Wafer Level Processing and Wafer Bumping Services

As one of the leading test houses in Taiwan, Winstek Semiconductor offers proven expertise in mixed-signal, digital, embedded memory, consumer optics and wireless applications. With strategic relationships in place with the major foundries and assembly houses, Winstek Semiconductor can provide full turnkey test and assembly services for a smooth, uninterrupted delivery of your product. Our portfolio of advanced test platforms, experienced R&D and engineering teams can reduce your engineering burden and ready your product for commercial success in the shortest time possible.

As one of the fastest growing package types in the semiconductor industry, Wafer Level Packages (WLP) offer a small, lightweight, high performance device that is a cost effective solution for mobile and consumer applications. With state-of-the-art 300mm manufacturing capabilities and advanced process technologies such as low cure temperature polymers, under bump metallization (UBM) and redistribution layers (RDL), Winstek Semiconductor is a leader in wafer bump and WLP solutions.