【Company History】
| Date | Winstek Semiconductor History |
|---|---|
| 2000 | - Founded |
| 2001 | - STATS acquired ~52% in Winstek |
| 2005 | - IPO Listed on Taiwan Stock Exchange (OTC, 3265) - Established Bump line in TSMC with Capa. Of 10,000 wafers/Month |
| 2007 | - Rename to “StatsChipPac Taiwan Semiconductor Corp.” |
| 2008 | - Commencement of 12” bump line |
| 2011 | - Commencement of WLCSP production - Movement of 12” bump line out of TSMC - Successfully brought up Cu Pillar bump technology for fine pitch products & mass production |
| 2015 | - JCET & STATS M&A, Temasek became major shareholder - On 9/30, the name was officially changed to "Winstek Semiconductor Corporation" |
| 2017 | - 52% controlling stake (formerly owned by Bloomberia, or Temasek Bloomberg) of Winstek bided by Sigurd |
| 2018 | - Commencement of 8” WLCSP line, RA/FA Lab, SMT Line |
| 2020 | - Commencement of Flip Chip Line |
| 2021 | - Develop cutting-edge Silicon Photonics related packaging and testing technology |
| 2022 | - Promote ESG sustainable management, and continue to participate in environmental issues and public welfare activities |
| 2023 | - Passed the audit on 4/28, obtained RBA certification in May, and was awarded the silver medal |