【Board Level Reliability】

Mechanical Shock

Evaluating the IC package, during the process, packaging, transportation and normal use, the solder joint position (Solder Joint) will cause deformation and damage to the service life due to the dynamic deformation of the board.

Test condition


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Reference Specification

JESD 22-B104
JESD 22-B111

Vibration Test

When the product is subjected to the vibration stress effect, the vibration reaches the repeated stress and causes fatigue, which is easy to cause the board level of the solder joint to break. At the same time, the component is subjected to vibration to generate a resonance response due to the natural frequency response of the assembly method or mechanism design (Resonance Amplification). The phenomenon is more damaging to the structure.

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Test condition


Image Description

Reference Specification

JESD 22-B103
MIL-STD 883 method 2007
ASTM D4169

Board Level Temperature cycle Test

When assessing surface-adhesive parts, under the fatigue effect of temperature and heat cycle, the mechanical fatigue and deformation of the potential of the solder joint material can be used to understand the potential hazard system and component factors.

Image Description

Reference Specification

JESD 22-A104
IPC-9701