Moisture Sensitive Level / MSL

It is primarily validated for surface mount components (SMD) or for parts types that have undergone SMT reflow procedures. The judgment method mainly determines the delamination position and the delamination ratio by ultrasonic scanning (SAT or SAM), and thereby formulates the humidity sensitivity level.

Test condition

Moisture sensitivity level can vary greatly depending on the moisture conditions of the device, ranging from Level 1 to Level 6.

Reference Specification

1IPC/JEDEC J-STD-020
JESD22-A113

Temperature Cycling Test

The temperature cycling test is a important item in the reliability test. By alternating several cycles of cold and heat, to aging Fatigue effect of the sample is caused by the difference in expansion coefficient.

Test condition

The temperature change rate of 5 to 15 degrees per minute and a series of high and low temperature loop tests on temperature changes. Its purpose is to apply stress to the object to be tested, to accelerate its aging factors, so that the sample may damage system and components under environmental factors. To determine whether the test piece is properly designed or manufactured.

Thermal Shock

In the life cycle of a product, it may face various environmental conditions, causing the product to appear in a vulnerable part, causing damage or failure of the product, thereby affecting the reliability of the product.

Test condition

The temperature change rate of more than 40 degrees per minute, the high temperature and low temperature impact test is performed on the rapid change of temperature. Its purpose is to apply severe stress on the object to be tested, to accelerate its aging factors, so that the sample may potentially damage the system equipment and components under environmental factors to determine whether the test piece is correctly designed or manufactured.

Reference Specification

JESD 22-A104
JESD 22-A106

Highly Accelerated Stress Test

The purpose of the accelerated life test is to increase environmental stress (such as temperature) and operating stress (voltage, load, etc. applied to the product), speed up the test process, and shorten the life time of the product. Used to investigate when electronic components and mechanical parts are worn and service life

Test condition

Pressure Cook Test

It is called pressure cooker cooking test or saturated steam test. The most important thing is the test object under severe temperature, saturated humidity (100% RH) [saturated water vapor] and capacity of pressure wet humidity environment.

Test condition

Reference Specification

JESD 22-A110
JESD 22-A118
JESD 22-A102