【Die Processing Services】

Die Processing Services (DPS)

One-Stop Die Processing for Packaging & Test

Our Die Processing Services (DPS) provide a complete front-end solution for wafer grinding, singulation, and tape & reel.
Designed for OSAT, IDM, and advanced packaging customers, DPS streamlines pre-packaging processes, improves production stability, and ensures readiness for high-volume manufacturing.

Service Scope

Wafer Grinding

Advanced Wafer Thinning Capability

  • Inline wafer grinding for ultra-thin wafers below 250 µm
  • DBG (Dicing Before Grind) process for wafers below 100 µm
  • Supports high-stress and high-topography wafers

Wafer Singulation

High-Efficiency Dicing for Mass Production

  • Laser Grooving
  • Conventional Blade Saw

Supported Wafer Types

  • Low-k / NOR Flash
  • GaN / SiC
  • CSP / BSM
  • Stacked Wafers

Tape & Reel

Ready-to-Use Die Delivery

  • Tape & Reel
  • Wafer on Ring
  • Waffle Tray

Inspection & Sorting

  • Reel-to-Reel / Reel-to-Wafer
  • 5-Sides Optical Inspection
  • Infrared (IR) Inspection
  • Flipper / Non-Flipper Options
  • Full Die Traceability

Process Capability

Grinding

  • Wafer Thickness: < 100 µm
  • Compatible with High Stress / High Topography Wafers

Singulation

  • Materials: Si, Low-k, GaN, SiC
  • Structures: CSP / BSM / Stacking

Tape & Reel

  • Die Size: 0.3 × 0.3 mm ~ 8.0 × 6.0 mm
  • Die Thickness: 50 µm ~ 1500 µm

Supported Conditions

  • Die Feeding: Wafer or Reel
  • Wafer Thickness: ≥ 50 µm
  • Materials: Si, Compound Semiconductors, GaN, Low-k
  • Output Format: Reel-to-Reel or Waffle Tray

Customer Value

  • Integrated Grinding + Singulation + Tape & Reel services
  • Reduced process complexity and handling risk
  • Optimized for advanced packaging and high-reliability applications
  • Ready-to-run format for downstream packaging lines

Target Applications

  • OSAT
  • IDM Packaging Operations
  • Power, Automotive, and Industrial ICs
  • Fabless Semiconductor Companies

Key Highlights

  • One-Stop Die Processing Services
  • Ultra-Thin Wafer Capability Below 100 µm
  • Full Coverage of Si / GaN / SiC / Low-k / Stacked Wafers
  • Ready-to-Run Tape & Reel Delivery