【Flip Chip Package】


Flip Chip

Flip chip packaging are selected for high I/O pin count devices, and the package solution provides better performance on thermal, EMC, and EMI issue. It can also sustain better reliability and stress compared to other compact packages.


Applications

AP, PMU, Smart Card, RF, PA, MEMS & Sensor, UC controller, EEPROM/DRAM/Flash/SRAM

Image Description

Image Description

Image Description


MCM (Multi Chip Module)

MCM is available now in Winstek, current capability could place 3 chips in a SBT module with SMT components attached.

Image Description


Comparison Table of Flip Chip and WLCSP

Image Description


Flip Chip Package Types

Image Description


Flip Chip Process Flow

Image Description