【Flip Chip Package】


Flip Chip

Flip chip packaging are selected for high I/O pin count devices, and the package solution provides better performance on thermal, EMC, and EMI issue. It can also sustain better reliability and stress compared to other compact packages.


Applications

AP, PMU, Smart Card, RF, PA, MEMS & Sensor, UC controller, EEPROM/DRAM/Flash/SRAM

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Comparison Table of Flip Chip and WLCSP

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Flip Chip Package Types

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Flip Chip Process Flow

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