【Singulation】

Singulation

Leakage is one of the major problems faced in Advance IC technology. Low-K material cannot sustain conventional mechanical saw singulation. Thus, laser grooving applied as pre cut to mitigate saw induced defects.

Winstek also developed the advance dicing technology which can cope with narrower scribe lines (Below 45um)

Plasma Dicing
Stealth Dicing + Tape Expanding

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Specifications & Capability

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