Copper Pillar
Copper Pillar Bump available for high I/O pin count devices with fine bump pitch, and the package solution provides better performance on heat effect, EMC, and EMI issue. And FC package also act as high reliability and low cost solution from others package type.
Applications
AP, PMU, ASIC, MEMS & Sensor, UC controller, DRAM
Specification & Capability
Copper Pillar Bump Process Flow
