Lead Free Bump

For environment protection purpose, lead is not allowed to in electronic industry. So the C4 solder bump changed it’s component from High Lead(Sn5-PB95), Eutectic(Sn63-Pb37) to LF Bump(SnAg1.8%), and now used in almost all process in flip chip and WLCSP packages.

Applications

Smart Card, VCM Driver, Switch, Audio & Video, EEPROM/FLASH/SRAM, MEMS & Sensor, UC Controllers

Specifications & Capability

Lead Free Bump Process Flow