【Backside Metallization】

Backside Metallization

High performance computing will generate high volume heat during calculation. Backside metallization are with deposition of metal layers on the bare backside silicon to enhance its thermal conductivity. It provides better thermal efficiency than conventional Epoxy Molded packages.

Image Description


Applications

PMIC, High Performance Computing, AIoT Edge Computing, Cryptocurrency, Heat Sink, EMI Shield…etc

Image Description


Specifications & Capability

Image Description

Image Description Image Description


Backside Alignment

To expose the backside patterning align with the frontside circuit pattern, the scribe line will not be covered by metal to cause the poor dicing quality.

Image Description Image Description


Backside Metallization Process Flow

Image Description