【Backside Metallization】

Backside Metallization

High performance computing will generate high volume heat during calculation. Backside metallization are with deposition of metal layers on the bare backside silicon to enhance its thermal conductivity. It provides better thermal efficiency than conventional Epoxy Molded packages.

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Applications

PMIC, High Performance Computing, AIoT Edge Computing, Cryptocurrency, Heat Sink, EMI Shield…etc


Specifications & Capability

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Backside Metallization Process Flow

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