【Plating BUMP/Ball Drop/RDL】

Plating Bump / Ball Drop

Base on customer specified requirements, Winstek could offer non-standard WLCSP bump structure (For example: WLCSP with plating bump to minimize the total package height.)

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Redistribution Layer

Larger package size could be found with tradition lead frame package. Implementing Fan-In Redistribution Layer could maintain the package size that is similar to chip original size yet provide better electrical performance than traditional wire bonding process by reducing the signal transmission path.

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