Wafer Level Chip Scale Package

WLCSP is the smallest, thinnest package type compare to others. (Its dimension almost equal to chip size)

Its application used for mobile and wearable devices. Offered with Plating and Ball Drop solder bumps.

Applications

IPD, PMU, Local Power, VCM Driver, Switch, Audio & Video, EEPROM, MEMS & Sensor, PA

Specification & Capability

Cross Section Images of WLCSP

WLCSP Process Flow