Stress Buffer Layer for Heterogeneous Integration Stacking

Utilizing the high flexibility and toughness of thick Polyimide (PI), it serves as a stress buffer layer between stacked heterogeneous materials and components. This effectively absorbs mechanical stress induced by package warpage or thermal cycling, thereby preventing interlayer delamination and crack propagation.

Localized Insulation and Thermal Dissipation for High-Power Devices

In high-power packaging, thick PI functions as a high-voltage dielectric layer between metal conductors. Its high dielectric strength and thermal stability (withstanding temperatures >300°C) prevent electrical arc breakdown under high voltage. Furthermore, by modifying the formulation—such as incorporating thermally conductive fillers—thick PI can simultaneously provide localized insulation and thermal conductivity, facilitating heat dissipation from the active region.