裸晶切割封裝服務Die Processing Services
台星科提供從晶圓薄化（Wafer Grinding）、精密切割（Saw）、到包裝出貨（Tape & Reel）的完整一站式服務（One-Stop Shop），透過高度整合的前段製程，協助封裝測試客戶簡化繁複供應鏈、提升量產穩定度，並確保後段封裝與測試階段的最高良率。WINSTEK offers a fully integrated one-stop service spanning wafer grinding, precision sawing, and packaging/shipment (tape & reel). Through highly integrated front-end processes, we help OSAT and test customers simplify complex supply chains, improve mass-production stability, and ensure maximum yield in downstream packaging and test operations.
核心技術與優勢Core Technologies & Advantages
支援 250µm 以下超薄晶圓 In-Line Grinding、100µm 以下 DBG（Dicing Before Grind）先進工藝，並具備處理高應力（High Stress）與高地貌（High Topography）晶圓的工藝能力。Supports in-line grinding for ultra-thin wafers below 250µm and advanced DBG (Dicing Before Grinding) below 100µm, with process capability for handling high-stress and high-topography wafers.
以 Stand-alone Marking 或 Marking through tape 兩種工藝，針對 Si、BSL、Ag、Cu、Ni 晶背材質皆可藉由雷射印碼，以字碼或二維條碼提供批號、刻號、座標軸以供日後品質追溯。Using either stand-alone marking or marking through tape, laser marking can be applied to Si, BSL, Ag, Cu and Ni wafer backsides, recording lot number, wafer ID and die coordinates as alphanumeric text or 2D codes for future quality traceability.
靈活運用雷射溝槽（Laser Groove）與傳統刀片切割（Conventional Blade Saw），對應 Si Low-k、NOR Flash、GaN、SiC、Glass 等先進半導體材料，以及 BSM(Ag、Cu、Ni) 與堆疊晶圓(Stacking Wafer)。Flexibly combines Laser Groove and conventional blade sawing to address advanced materials such as Si Low-k, NOR Flash, GaN, SiC, and Glass, as well as BSM (Ag, Cu, Ni) and stacked wafers.
支援 Tape & Reel、Wafer on Ring 與 Reel-to-Reel 轉換，具備 5 面光學檢驗（正面、背面、側壁）、IR 檢測／Flipper 和Non-Flipper 技術及完整的 Die Traceability（晶粒履歷追蹤）。Supports Tape & Reel, Wafer on Ring, and reel-to-reel conversion, with 5-side optical inspection (top, bottom, sidewalls), IR inspection/flipper and non-flipper technology, and full die traceability.
規格能力表Specifications & Capability Table
為客戶創造的關鍵價值Key Value Delivered to Customers
適用客戶Target Customers
關鍵亮點Key Highlights
晶圓薄化製程Wafer Grinding Process
在追求輕薄短小的先進封裝趨勢下，晶圓薄化面臨著極高的應力與翹曲（Warpage）挑戰。我們透過嚴謹的關鍵製程參數管控與高階設備，從研磨保護膠帶的精準貼合、乾式拋光研磨的表面品質，到 In-Line 系統整合與製程解決方案，全面守護超薄晶圓在製程中的穩定度與平坦度，滿足客戶對高品質極限厚度的嚴苛期待。Amid the drive toward thinner, lighter advanced packaging, wafer thinning faces significant stress and warpage challenges. Through rigorous control of critical process parameters and advanced equipment—from precision lamination of grinding protective tape and dry-polish surface quality, to In-Line system integration and tailored process solutions—we safeguard the stability and flatness of ultra-thin wafers throughout processing, meeting customers’ most demanding requirements for extreme thickness reduction.
核心製程優勢Core Process Advantages
規格與能力表Specifications & Capability Table
晶背雷射印碼Backside Laser Marking
晶圓晶背雷射印碼（Wafer Backside Laser Marking）在不破壞正面電路的前提下，為晶粒提供永久的「身分證」，以實現全製程的追溯與良率管理。支援裸片晶圓（Stand-alone）以及帶鐵圈的薄晶圓（Marking through tape），對應 Si、BSL、Ag、Cu、Ni 晶背材質的雷射印碼，以及 2D Code 的雷射印碼。Wafer backside laser marking gives each die a permanent identity without damaging front-side circuitry, enabling full-process traceability and yield management. It supports stand-alone wafers as well as thin wafers on frames (marking through tape), covering Si, BSL, Ag, Cu and Ni backside materials, together with 2D code laser marking.
切割服務Dicing Services
面對新世代介電層材料（如 Low-K 等易脆特性），傳統單純刀輪切割極易產生微小暗裂（Micro-cracks）並導致晶片功能失效。我們透過導入先進的雷射開槽技術（Laser Groove）與多元切割解決方案，完美克服材料極限，確保每一個晶粒的邊緣結構完整。無論是標準晶圓、極窄切割道需求，或是碳化矽（SiC）、Glass、GaN、BSM、Stacking Wafer等特殊晶圓，我們皆能提供全方位的專業代工與製程整合能力。Advanced dielectric materials (such as brittle low-k films) are prone to micro-cracking and functional failure under conventional blade dicing alone. By adopting advanced Laser Groove technology alongside diverse dicing solutions, we overcome these material limitations and preserve the structural integrity of every die edge. Whether standard wafers, ultra-narrow scribe-line requirements, or specialty wafers such as SiC, Glass, GaN, BSM, and stacked wafers, we deliver comprehensive foundry service and process integration capability.
核心切割技術Core Dicing Technologies
規格與能力表Specifications & Capability Table
捲帶包裝與出貨Tape & Reel Service
載帶寬度與晶粒尺寸對應Carrier Tape Width vs. Die Size Range
捲帶包裝流程Tape & Reel Process Flow
- 01Wafer / Die Input晶圓／晶粒投入
- 02Die Picking & Orientation晶粒取放與方向校正
- 03Multi Vision Inspection多視角光學檢測
- 04Tape & Reel Packaging捲帶包裝
- 052D Code Reading & Traceability二維條碼讀取與追溯
- 06Finished Reel完成捲盤