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ABOUT WINSTEK

關於我們About Us

從凸塊製程起家,一路以國際品質標準與先進資訊系統,成為半導體後段服務的可信賴長期夥伴。 Starting from bumping process expertise, we have grown into a trusted long-term partner in semiconductor back-end services through international quality standards and advanced information systems.

公司基本資料Company Profile

統一編號Unified Business No.
70552666
實收資本額Paid-in Capital
新台幣 1,362,616,590 元NT$1,362,616,590
股票代碼Stock Code
3265
成立日期Date of Establishment
2000年4月26日April 26, 2000
登記地址Registered Address
新竹縣芎林鄉華龍村6鄰鹿寮坑176-5號No. 176-5, Luliaokeng, Lin 6, Hualong Village, Qionglin Township, Hsinchu County, Taiwan (R.O.C.)

經營團隊Management Team

總經理 翁志立President Richard Weng
Mr. Richard Weng

於2000年創立本公司,帶領公司成長與發展,具備豐富的產業經驗與經營管理背景。曾於華鴻公司擔任總經理及福懋、日月光等同質產業擔任高階主管職務,深厚的專業實力與領導能力帶領著本公司穩健發展,奠定良好營運基礎與市場地位。翁先生並持續以其卓越的產業洞察與經營經驗,推動公司永續成長。Founded the Company in 2000 and has led its growth and development ever since, bringing extensive industry experience and management expertise. He previously served as General Manager of Amtek and held senior management positions at comparable companies such as Formosa Advanced Technologies and ASE. His deep professional expertise and leadership have guided the Company's steady development, establishing a solid operational foundation and strong market position. Mr. Weng continues to drive the Company's sustainable growth through his outstanding industry insight and management experience.

畢業於美國伊利諾理工學院研究所。M.S., Illinois Institute of Technology, USA.

Test營運處副總經理 黃皓紀Vice President of Test Operations Steven Huang
Mr. Steven Huang

現任本公司測試營運副總經理,曾任台星科業務處長一職,掌握市場脈動並成功開拓公司多項業績版圖。依其深厚的業務實戰背景及營運管理能力,引領團隊致力達成公司發展目標。Currently serves as Vice President of Test Operations at the Company, having previously served as Director of the Sales Division at Winstek, where he closely tracked market trends and successfully expanded the Company's business across multiple areas. Drawing on his strong hands-on sales background and operational management capabilities, he leads his team in driving the Company toward its development goals.

畢業於陽明交通大學EMBA碩士。EMBA, National Yang Ming Chiao Tung University.

公司沿革Company History

2024
— 發行首本永續報告書,並經董事會通過(中、英文版同步發行)Published the first sustainability report, approved by the Board (released simultaneously in Chinese and English)
— 台星科股份有限公司於 12/20 通過稽核,於 2025 年 1 月取得 RBA 認證,獲頒銀牌Winstek passed the audit on Dec 20 and obtained RBA certification (Silver) in January 2025
2023
— 台星科企業股份有限公司於 4/28 通過稽核,5 月取得 RBA 認證,獲頒銀牌Winstek passed the audit on Apr 28 and obtained RBA certification (Silver) in May
2022
— 推動 ESG 永續經營,針對環境議題與公益活動持續參與Advanced ESG sustainability practices, continuing engagement in environmental and charitable initiatives
2021
— 發展高階矽光子(Silicon Photonics)相關封測技術Developed advanced Silicon Photonics packaging and testing technology
2020
— 建立覆晶(Flip Chip)生產線Established a Flip Chip production line
2018
— 建立 8 吋 WLCSP 生產線、RA/FA 實驗室、SMT 生產線Established 8-inch WLCSP production line, RA/FA lab, and SMT production line
2017
— 由 Sigurd(矽格)取得 Winstek 52% 控股權(原由Bloomberia/Temasek Bloomberg擁有)Sigurd acquired 52% controlling stake in Winstek (previously held by Bloomberia/Temasek Bloomberg)
2015
— JCET 與 STATS 進行併購,淡馬錫成為主要股東JCET merged with STATS; Temasek became a major shareholder
— 9/30 正式更名為「Winstek 台星科股份有限公司」Officially renamed to "Winstek" on Sep 30
2011
— 開始提供晶圓級封裝 WLCSP 服務Began offering WLCSP wafer-level packaging services
— 將台積電 12 吋 Bump 產品線移出Transferred out TSMC's 12-inch Bump product line
— 成功推出銅柱凸塊技術,用於細間距產品並開始大量生產Successfully launched copper pillar bump technology for fine-pitch products, entering mass production
2008
— 開始提供 12 吋電鍍焊錫凸塊服務Began offering 12-inch electroplated solder bump services
2007
— 更名為「StatsChipPac Taiwan Semiconductor Corp. 台灣星科金朋半導體公司」Renamed to "StatsChipPac Taiwan Semiconductor Corp."
2005
— 獲金管會證期局核准上櫃(股票代碼:3265)Approved for OTC listing by the FSC (stock code: 3265)
— 在台積電廠內建立 Bump 產品線,產能為 10,000 晶圓/每月Established a Bump product line inside TSMC's facility with capacity of 10,000 wafers/month
2001
— STATS 在 Winstek 獲得約 52% 股份STATS acquired approximately 52% stake in Winstek
2000
— 公司成立Company founded

品質認證Quality Certifications

QUALITY POLICY
我們承諾給予客戶最優質的服務;並且持續地增強我們營運上的優勢。We are committed to providing our customers the highest quality of service, while continuously strengthening our operational advantages.
HAZARDOUS SUBSTANCE POLICY
我們承諾給予客戶「無有害物質」的產品;並且持續地增強我們營運上的優勢。We are committed to providing our customers hazardous-substance-free products, while continuously strengthening our operational advantages.
國際認證證書International Certifications
ISO 9001
版本 2015Ver. 2015
▾
原始日期:2000/10/23Issued: 2000/10/23
有效日期:2027/5/5Valid until: 2027/5/5
查看證書 (PDF)View Certificate (PDF)
IATF 16949
版本 2016Ver. 2016
▾
原始日期:2018/5/30Issued: 2018/5/30
有效日期:2027/5/5Valid until: 2027/5/5
查看證書 (PDF)View Certificate (PDF)
ISO/IEC 17025
版本 2017Ver. 2017
▾
原始日期:2018/5/30Issued: 2018/5/30
有效日期:2027/5/29Valid until: 2027/5/29
查看證書 (PDF)View Certificate (PDF)
ISO 14001
版本 2015Ver. 2015
▾
原始日期:2004/6/7Issued: 2004/6/7
有效日期:2027/4/18Valid until: 2027/4/18
查看證書 (PDF)View Certificate (PDF)
ISO 45001
版本 2018Ver. 2018
▾
原始日期:2006/9/26Issued: 2006/9/26
有效日期:2027/4/25Valid until: 2027/4/25
查看證書 (PDF)View Certificate (PDF)
SONY GP - Test
▾
原始日期:2010/10/31Issued: 2010/10/31
有效日期:2028/4/30Valid until: 2028/4/30
查看證書 (PDF)View Certificate (PDF)
SONY GP - Assembly
▾
原始日期:2020/4/1Issued: 2020/4/1
有效日期:2028/8/31Valid until: 2028/8/31
查看證書 (PDF)View Certificate (PDF)
ANSI ESD S20.20
版本 2021Ver. 2021
▾
原始日期:2022/12/14Issued: 2022/12/14
有效日期:2026/12/13Valid until: 2026/12/13
查看證書 (PDF)View Certificate (PDF)
ISO 14064-1
版本 2018Ver. 2018
▾
原始日期:2025/5/6、2026/08/10Issued: 2025/5/6, 2026/08/10
有效日期:—Valid until: —
ISO 14067
版本 2018Ver. 2018
▾
原始日期:2022/11/11Issued: 2022/11/11
有效日期:2027/2/5Valid until: 2027/2/5
查看證書 (PDF)View Certificate (PDF)
RBA VAP
版本 8.0.1Ver. 8.0.1
▾
原始日期:2025/1/11Issued: 2025/1/11
有效日期:2026/12/20Valid until: 2026/12/20
查看證書 (PDF)View Certificate (PDF)
ISO 50001
版本 2018Ver. 2018
▾
原始日期:2024/12/1Issued: 2024/12/1
有效日期:2027/11/30Valid until: 2027/11/30
查看證書 (PDF)View Certificate (PDF)