以綠色製程、再生能源與資源循環，為半導體產業的永續未來盡一份心力。Through green processes, renewable energy and resource circularity, we contribute to a sustainable future for the semiconductor industry.
台星科提供晶圓凸塊、晶粒處理、覆晶接合、晶圓與成品測試，以及可靠度驗證與失效分析，支援 200mm 與 300mm 晶圓。 Winstek provides wafer bumping, die preparation, flip chip assembly, wafer sort and final test, plus reliability assurance and failure analysis, supporting both 200mm and 300mm wafers.
大尺寸 FCBGA（60×60mm 以上）翹曲控制、2.5D/Hybrid Bonding 整合、高功率 Tri-Temp 測試，滿足 AI 加速器與伺服器級晶片的散熱與訊號完整性挑戰。 Large-body FCBGA (60×60mm+) warpage control, 2.5D/hybrid bonding integration, and high-power Tri-Temp testing for AI accelerators and server-class silicon.
IATF 16949 製程管控、Operating Life Test／Board-Level Reliability、ORT/ORM 長期監控，符合車規可靠度要求與長生命週期供應保證。 IATF 16949 process controls, Operating Life Test / Board-Level Reliability, and ORT/ORM monitoring for automotive-grade reliability.
WLCSP／SiP 小型化封裝、多晶片異質整合，兼顧成本效益與長期供貨穩定性，滿足終端裝置量產需求。 WLCSP/SiP miniaturized packaging and multi-die heterogeneous integration, balancing cost efficiency with long-term supply stability for volume production.
與我們的業務團隊討論您的封裝與測試需求。Talk with our sales team about your assembly and test requirements.
