晶圓測試Wafer Testing Services
核心優勢Core Advantages
台星科提供全方位且高精準度的晶圓測試與分類服務，為客戶嚴格把關每一片晶圓的品質與良率，確保後段封裝的高可靠度。 Winstek provides comprehensive and high-precision wafer testing and sorting services, ensuring strict quality and yield control for every wafer to guarantee high backend reliability.
測試範疇Testing Scope
完整涵蓋探針卡維修、針測機網路客製化（提供客戶即時的資料處理）、300 毫米（12 吋）晶圓測試、晶圓凸塊測試、薄晶圓測試，以及多晶粒（x16／x32）晶圓測試等全方位解決方案。 Comprehensively covering probe card maintenance, customized prober networking (providing real-time data processing for customers), 300mm (12-inch) wafer testing, wafer bump testing, thin wafer testing, and multi-die (x16/x32) parallel probing solutions.
高階測試設備與平台Advanced Wafer Prober Platforms
導入 Precio、Precio XL、Prexa（具備 UTCS 均溫卡盤系統／Uniformized Temperature Chuck System）等高階針測設備，確保測試時的溫度均勻性與高靈敏度。 Deployed advanced probers including Precio, Precio XL, and Prexa (equipped with UTCS - Uniformized Temperature Chuck System) to ensure precise thermal uniformity and extreme probing sensitivity.
配置高效能的 UF3000LX 與 FP3000（Frame Prober），提供穩定且卓越的晶圓針測實力。 Configured with high-performance UF3000LX and FP3000 (Frame Prober) systems, delivering stable and superior wafer probing capabilities.
建置 OPUS III 專業針測系統，實現高彈性與高效率的測試產能。 Established OPUS III professional probing systems to achieve flexible and high-throughput test capacity.
即時資料與客製化應對Real-Time Data & Customized Response
透過針測機網路客製化優勢，即時處理大量測試數據，滿足各類高階晶片在測試階段的精準管控與資訊回饋需求。 Through customized prober network integration, we process massive test data in real time, meeting the stringent yield control and instant feedback requirements for advanced chips.
測試平台Testing Platforms
測試平台核心優勢與選項Platform Capabilities & Options
台星科提供全方位、高度彈性的測試平台選項，滿足各類高階晶片的多樣化測試需求。 Winstek provides a full suite of highly flexible testing platform options to meet the complex testing demands of advanced semiconductors.
國際測試設備陣容International Tester Fleet
涵蓋 93000 Series，以及導入最新 V93K Exa Scale 測試平台，展現持續升級的高階測試實力。 Covers 93000 Series and advanced V93K Exa Scale test platforms, demonstrating continuously upgraded high-end testing prowess.
涵蓋 UltraFlex (RF)、I-Flex (RF)、J750、J750EX 以及 Magnum II，提供卓越的射頻與多元晶片測試能量。 Covers UltraFlex (RF), I-Flex (RF), J750, J750EX, and Magnum II, offering outstanding RF and SOC testing capabilities.
完整測試設備配置與規格能力Tester Configurations & Specifications
| Tester | Config Options |
|---|---|
| EXA (PS5000) | DC Instrument：XPS256／UHC4T／XHC32 High Speed Digital：PS5000 |
| PS1600 | DC Instrument：CSDPS128, CSDPS64, CSDPS32, UHC4/T, HCDPS, MSDPS, GSDPS |
| PS400／PS800 | High Speed Digital：PinScale 9G, PS3600, PS1600, PS800, PS400, P600, C200e Analog Instruments：MBAV8, MCE, MCB, MCA, WGD, WGE, AVI64, TIA * Small TH(4CC), Compact TH(2CC), Large TH(8CC) |
| C200e／C400e／P600 | 與 PS400／PS800 高速數位與模擬儀器配置共用 Shared with PS400/PS800 high-speed digital & analog instruments |
| U-Flex RF | DC Instrument：DC-30, HexVS, UltraV180 High Speed Digital：HSD-1600, HSD-800 Analog Instruments：BBAC-15, UVS256, TurboAC, UltraPAC80, UltraWave 12G |
| I-Flex | DC Instrument：DC-30, DC-75 Digital：HSD-200 Analog Instruments：BBAC-15, VHFAC |
| J750EX | DC Instrument：DPS, HDDPS Digital：HSD-200 Analog Instruments：CTO, DSMTO |
| J750 | DC Instrument：DPS, HDDPS Digital：HSD-100 Analog Instruments：MTO, ASIO, DSIO |
| Magnum II | Digital：CH1280 |
* Willing to invest upon customer's demand, consign model is welcome
成品測試Final Test (FT)
成品測試核心服務與工程優勢Core Final Test Services & Engineering Advantages
台星科提供高精度、高效率的成品測試與自動化分選解決方案，為客戶嚴格把關晶片出貨前的最後品質。Winstek delivers high-precision, high-efficiency final testing and automated handling solutions, safeguarding shipment quality before market release.
具備靈活且高效的測試平台轉換能力，滿足各類高階測試需求。Flexible, efficient platform conversion to meet diverse advanced test needs.
精準掌握晶片在終端應用時的電氣與效能特性。Precise profiling of electrical and performance characteristics under end-application conditions.
透過專業團隊優化測試流程，提升量產效率與良率。Dedicated engineering teams optimizing test flows to raise production efficiency and yield.
依客戶需求提供專屬測試座與轉換套件的委託製作與高效整合服務。Turnkey fabrication and integration of dedicated test sockets and change kits to customer specifications.
高階自動化分選設備陣容Advanced Automated Handler Fleet
配置 S 系列（包含 S9、S9+）以及具備 Tri-temp 溫控能力的 S11 平台，完美支援多元高溫與寬溫測試挑戰。S series (S9, S9+) plus the Tri-temp capable S11 platform, fully covering high- and wide-temperature test challenges.
配置 NS 系列（包含 NS6000、NS6040、NS7000），提供穩定卓越的大規模自動化分選與精準控溫實力。NS series (NS6000, NS6040, NS7000) delivering stable, large-scale automated handling with precise temperature control.
配置 HT3000 高效能 Handler 系統，滿足多元化晶片成品測試的產能需求。HT3000 high-performance handler system, meeting diverse final-test capacity requirements.
Handler 設備規格與平台對應能力Handler Specifications & Platform Compatibility
| Handler Type | NS6000／6040 | NS7000 | S9 | S9+ | S11 |
|---|---|---|---|---|---|
| Temperature (°C) | 25 ~ 130 | 25 ~ 130 | 25 ~ 150 | 25 ~ 150 | -55 ~ 130 |
| Arm Force | 40 KG | 60 KG | 225 KG | 240 KG | 240 KG |
| 93K／PS series Change Kit | Yes | Yes | Yes | Yes | Yes |
| U-flex／I-Flex Change Kit | Yes | Yes | Yes | Yes | Yes |
| J750／J750EX Change Kit | Yes | Yes | Yes | Yes | Yes |
| Package Size | 3x3 ~ 45x45mm | 3x3 ~ 45x45mm | 1x1 ~ 50x50mm | 1x1 ~ 50x50mm | 3x3 ~ 65x65mm |
| Parallel DUT | 2／4 duts | 2／4 duts | 2／8 duts | 2／16 duts | 2／16 duts |
測試後段服務Post-Test Services
核心能量Core Capabilities
提供高精度引腳／焊球外觀檢測與標準自動化捲帶包裝服務。High-precision lead/ball inspection with standard automated tape-and-reel packaging.
提供精準溫控烘烤程序，嚴格控管晶片濕氣敏等級（MSL）。Precisely controlled baking process to strictly manage Moisture Sensitivity Level (MSL).
符合國際標準的高品質防靜電與安全防護包裝方案。Internationally compliant, high-quality anti-static and protective packaging solutions.
支援靈活且高效的直運物流模式，協助客戶縮短產品上市時程。Flexible, efficient drop-ship logistics helping customers shorten time-to-market.
高階自動化檢測與處理設備陣容Advanced Automated Inspection & Handling Equipment
配置 KLA／ICOS 系列高階自動檢測與捲帶機台（包含 ICOS T390、ICOS CI-T120 等）。KLA／ICOS series advanced automated inspection and tape-and-reel machines (ICOS T390, ICOS CI-T120, etc.).
配置工業級高精密烘烤爐與自動化真空包裝系統。Industrial-grade precision baking ovens and automated vacuum packaging systems.