智慧財產管理Intellectual Property Management

智慧財產管理策略Intellectual Property Management Strategy

(一) 規範(1) Regulations

公司內部制定《知識產權管制管理辦法》與《專利申請程序》，確保本公司及相關方的知識產權受到有效的保護，特制定本辦法。本公司也擁有自己的專利、商標、技術等其它知識產權合法的權益，本公司客戶、協力商等相關方也只能在本公司授權的前提下才能合法使用本公司專利、商標、技術等其它知識產權。 The Company has internally established the "Intellectual Property Control and Management Measures" and "Patent Application Procedures" to ensure effective protection of the intellectual property rights of the Company and related parties. The Company holds legal rights to its own patents, trademarks, technologies, and other intellectual property. Customers, subcontractors, and other related parties may only legally use the Company's patents, trademarks, technologies, and other intellectual property with the Company's authorization.

(二) 客戶承諾(2) Customer Commitment

本公司只會在客戶授權的前提下合法使用客戶、協力商的專利、商標等其它知識產權，承諾不會盜用、侵害客戶、協力商的專利、商標、技術等其它智慧產權。同時遵守客戶產品機密，並簽定相關保密協議。 The Company will only legally use customers' and subcontractors' patents, trademarks, and other intellectual property with their authorization, and commits not to misappropriate or infringe upon customers' or subcontractors' patents, trademarks, technologies, or other intellectual property. The Company also observes customer product confidentiality and signs relevant non-disclosure agreements.

專利申請程序與研發策略Patent Application Process & R&D Strategy

專利申請程序與權責Patent Application Process & Responsibilities

(一) 定義(1) Definition

當產生新的構想、方法或裝置時，經由專利申請確保公司研發成果、技術能力尋求法律之保護，若其屬符合專利法之類別及保護客體，則宜儘速提出申請。申請專利權通常最起碼必須提交之文件及資料包括申請人及發明人之資料，以及一份能夠完全及充分地披露該發明的「專利說明書」，其應備具申請專利之各種書表，確保研發自主自由。 When a new concept, method, or device is created, patent application ensures legal protection for the Company's R&D outcomes and technical capabilities. If it falls within the categories and subject matter protected under patent law, an application should be filed promptly. Filing a patent typically requires, at minimum, information on the applicant and inventor, as well as a "patent specification" that fully and adequately discloses the invention, along with all required application documents to ensure R&D autonomy.

(二) 權責(2) Responsibilities

專利提案係由研發/工程相關人員提出，研發出新技術、新專案時，基於讓法律保護專利權，需負責填寫專利申請書向經濟部智慧財產局申請專利。由工程單位負責新技術測試可行性評估或提供相關器材資源。品保單位負責新技術測試與執行時適當性督導。文件管制中心負責歸檔與專利申請有關表單及文件至系統保存。 Patent proposals are submitted by R&D/engineering personnel. When new technology or projects are developed, the relevant personnel are responsible for completing patent applications to the Taiwan Intellectual Property Office to secure legal protection. The engineering unit is responsible for feasibility assessment of new technology testing or providing relevant equipment resources. The quality assurance unit oversees the appropriateness of new technology testing and execution. The document control center is responsible for filing and archiving patent application-related forms and documents in the system.

研發策略R&D Strategy

(一) 因應先進製程晶圓封裝製程和測試技術開發：(1) In response to advanced-process wafer packaging and test technology development:

• •先進製程晶圓封裝測試技術開發，如3奈米先進製程晶圓封裝測試。Advanced-process wafer packaging and test technology development, such as 3nm advanced process wafer packaging and test.
• •新晶圓級封裝型態的晶圓測試與更精密球間距的測試技術開發。New wafer-level package form wafer testing and ultra-precision ball pitch testing technology development.
• •5G無線射頻元件，整合型IC、MEMS、整合性分測服務、矽光子晶圓IC、Pin Scale/J750測試軟硬體開發。5G RF components, integrated ICs, MEMS, integrated probing services, silicon photonics wafer ICs, Pin Scale/J750 test hardware and software development.
• •開發新型態的先進封裝技術，以提供高效能的系統晶片(System on Chip)與系統級封裝(System in Package)服務。Development of new advanced packaging technologies to provide high-performance System on Chip (SoC) and System in Package (SiP) services.
• •多晶片覆晶，多層電路重佈值晶圓級封裝技術。Multi-chip flip-chip and multi-layer circuit redistribution wafer-level packaging technology.
• •SiC/GaN 特殊晶圓切割服務。SiC/GaN special wafer dicing services.
• •晶背金屬化製程。Backside metallization process.
• •矽光元件晶圓級封裝。Silicon photonics component wafer-level packaging.
• •極細薄片晶圓切割服務。Ultra-thin wafer dicing services.
• •基板嵌入式封裝技術開發。Substrate-embedded packaging technology development.
• •人工智慧檢驗系統。Artificial intelligence inspection system.
• •晶圓級玻璃基板。Wafer-level glass substrates.
• •高功率元件晶圓級封裝。High-power component wafer-level packaging.
• •系統級穩壓元件封裝製程。System-level voltage regulator component packaging process.
• •人工智慧晶片供電元件封裝及測試。AI chip power delivery component packaging and testing.

(二) 深入市場分析：研究市場趨勢、競爭與客戶需求，尋找研發與合作機會。(2) In-depth market analysis: Research market trends, competition, and customer needs to identify R&D and collaboration opportunities.

(三) 完善技術評估：評估未來技術發展趨勢，選擇最適合的技術路線。(3) Comprehensive technology assessment: Evaluate future technology development trends and select the most suitable technology roadmap.

研發來源與專利申請R&D Sources & Patent Applications

(一) 來源(1) Sources

本投資計畫之2.5D/3D IC封裝技術，由本公司技術團隊負責研發及累積，並配合未來產業及市場脈動持續開發。 The 2.5D/3D IC packaging technology under this investment plan is researched and accumulated by the Company's own technical team, and continues to be developed in line with future industry and market trends.

(二) 目前已通過之專利項目(2) Currently Approved Patents

對於智慧財產、營業秘密管理的資安防護措施Information Security Measures for IP & Trade Secret Management

• 1.針對存有機密資訊的資訊設備、系統及儲存進行權限管制，避免未經授權之存取。Access control is enforced on IT equipment, systems, and storage containing confidential information to prevent unauthorized access.
• 2.保留檔案存取、帳號登入及電子郵件使用歷程供勾稽。File access, account login, and email usage history are retained for audit purposes.
• 3.限制遠端連線存取，無法透過端端階段直接傳送檔案或複製機密資訊。Remote access is restricted, preventing direct file transfer or copying of confidential information via end-to-end sessions.
• 4.定期備份機密資訊並異地存放，備份媒體進行加密。Confidential information is regularly backed up and stored off-site, with backup media encrypted.
• 5.針對備份與LOG紀錄有適當保存與管理，以確保其不可竄改性。Backups and log records are properly retained and managed to ensure their integrity and immutability.
• 6.針對機密資訊儲存媒體之銷毀，以無法復原之破壞方式處理，並保存銷毀之紀錄。Storage media containing confidential information are destroyed in an irrecoverable manner, with destruction records retained.

年度執行情形及智慧財產管理成果Annual Execution & IP Management Outcomes

▶ 智慧財產管理成果▶ IP Management Outcomes

1. 新人報到即簽署《保密合約書》，因職務所知悉或取得甲方及其他任何第三方之營業秘密、產品技術、營運管理作業或其他相關資料（以下簡稱「機密資料」）應盡保密之義務，不得揭露予任何第三人，或基於執行職務以外之目的使用機密資訊。 1. New employees sign a Confidentiality Agreement upon onboarding, obligating them to keep confidential any trade secrets, product technology, operational management practices, or other related information (collectively "Confidential Information") of the Company or any third party that they become aware of or obtain in the course of their duties, and prohibiting disclosure to any third party or use of such information for purposes outside their job duties.

2. 2025年已申請一項專利，目前已通過審查。 2. One patent application was filed in 2025 and has passed examination.

▶ 年度執行情形▶ Annual Execution Status

• 1.針對全體員工每年執行《機密安全簡介年度訓練》複訓，並設置線上測驗，確保認知一致。公司已於2025年5月進行年度訓練，全體員工997人完訓，合格率100%。Annual "Confidentiality & Security Briefing" refresher training is conducted for all employees, with an online test to ensure consistent understanding. The Company completed its 2025 annual training in May 2025, with all 997 employees completing the training at a 100% pass rate.
• 2.制定廠商機密資訊規定，訂進廠簽訂《委外廠商/駐廠(第三方)員工保密切結書》，遵守進出物品及門禁管制與電腦網路使用相關規範。宣導後一併性行考核試卷，文件落實率100%。Confidentiality regulations have been established for vendors, requiring outsourced/on-site (third-party) personnel to sign a Confidentiality Undertaking upon entry, complying with regulations on the movement of goods, access control, and computer network use. Following the briefing, an assessment quiz is administered, with 100% document compliance.
• 3.截至2025年9月30日止，無被告智財侵權之訴訟。As of September 30, 2025, the Company has faced no IP infringement lawsuits as a defendant.
• 4.本公司依據智慧財產管理計畫執行，已導入與營運策略結合之智慧財產管理制度，執行成果已於2025年10月27日提報董事會報告。The Company has implemented an intellectual property management system integrated with its operational strategy in accordance with its IP management plan, with execution outcomes reported to the Board of Directors on October 27, 2025.